Ultra low concentration clean: A new approach to feol critical wafer surface cleaning

ECS Transactions

Volumn 11, Issue 2, 2007, Pages 167-174

  Fischer, Thomas ^a   Puri, Suraj ^b   Hoyer, Ronald ^a   Wostyn, Kurt ^c   Janssens, Tom ^c  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b Nano Green Technology Inc   (United States)

^c IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

AMMONIA; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; SILICON COMPOUNDS; SURFACE CLEANING;

CLEANING TECHNOLOGY; NEW APPROACHES; NEW DIMENSIONS; SEMICONDUCTOR INDUSTRY; SEMICONDUCTOR MANUFACTURING; ULTRA LOW CONCENTRATION; WAFER SURFACE; WATER CLUSTER;

SILICON WAFERS;

EID: 45249088543     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2779376     Document Type: Conference Paper

References (4)

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2. Lo SY., "Physical Properties of Water with IE Structures" Modern Physics Letters B. 10, 921-930, (1996)
3. Suraj Puri et al,. "An Ultra Dilute Ammonia Process for Particle Removal" The Electrochemical Society Proceedings Volume 99-36, 180
4. Handbook STEAG AWP tool,