Engineering molecular mechanics: An efficient static high temperature molecular simulation technique

Nanotechnology

Volumn 19, Issue 28, 2008, Pages

  Subramaniyan, Arun K ^a   Sun, C T ^a  

^a Purdue University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; COPPER; DYNAMICAL SYSTEMS; DYNAMICS; ELASTIC CONSTANTS; MECHANICS; MOLECULAR DYNAMICS; MOLECULAR MECHANICS; MOLECULAR STRUCTURE; MOLECULES; NICKEL; QUANTUM CHEMISTRY; TECHNOLOGY; TEMPERATURE; THERMAL EXPANSION; THERMAL SPRAYING; THERMAL STRESS;

(ABIOTIC AND BIOTIC) STRESS; (O-SEC.-BUTYLDITHIOCARBONATIO-S ,S') COPPER; COMPUTATIONALLY EFFICIENT; CONVENTIONAL TECHNIQUES; HIGH TEMPERATURE (HT); INTER ATOMIC POTENTIAL; MOLECULAR DYNAMICS SIMULATIONS (MDS); MOLECULAR SIMULATIONS; TEMPERATURE DEPENDENCES; TEMPERATURE DEPENDENT; TEMPERATURE EFFECTS;

HIGH TEMPERATURE ENGINEERING;

COPPER; NICKEL;

ARTICLE; HIGH TEMPERATURE; MOLECULAR DYNAMICS; MOLECULAR MECHANICS; NANOENGINEERING; PRIORITY JOURNAL; SIMULATION; TEMPERATURE DEPENDENCE; TEMPERATURE STRESS;

EID: 44949262878     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/19/28/285706     Document Type: Article

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