X-ray fluorescence analysis of lead in tin coating using the theoretical intensity of scattered x-rays

X-Ray Spectrometry

Volumn 37, Issue 3, 2008, Pages 245-248

  Ochi, H ^a   Watanabe, S ^a   Nakamura, H ^b  

^a Horiyamashita ^*  (Japan)

^b SHIMADZU CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

NETWORK COMPONENTS;

BULK SOLDER; ELECTRONIC COMPONENT; FUNDAMENTAL PARAMETER METHOD; INTENSITY RATIO; LARGE SURFACES; SCATTERED X-RAYS; STANDARD SAMPLES; TIN COATING; X RAY FLUORESCENCE ANALYSIS; X-RAY MONITOR;

FLUORESCENCE;

EID: 44949113523     PISSN: 00498246     EISSN: 10974539     Source Type: Journal    
DOI: 10.1002/xrs.1054     Document Type: Article

References (10)

1. Ochi H, Minamitake S, Nakamura H. Shimadzu Rev. 2003; 60(3-4): 137.
2. Shiraiwa T, Fujino N. Jpn. J. Appl. Phys. 1966; 5: 886.
3. Ochi H, Okashita H. Shimadzu Rev. 1988; 45(1-2): 51.
4. Ochi H, Shiota T, Nishino M. Shimadzu Rev. 1992; 49(1-2): 85.
5. Ochi H, Watanabe S. Adv. X-Ray Chem. Anal. Jpn. 2006; 37: 45.
6. Kellogg RB. Adv. X-Ray Anal. 1984; 27: 441.
7. Mantler M. Anal. Chimi. Acta. 1986; 188: 25.
8. Ibers JA, Hamilton WC. International Tables for X-Ray Crystallography, vol. 4. Kluwer: Boston, MA, 1974; 71.
9. MacGillavry CH, Rieck GD. International Tables for X-Ray Crystallography, vol. 3. D.Reidel: Boston, MA, 1968; 159, 247.
10. Nakamura H, Kaneuchi T, Nishino M, Kuwabara S. Shimadzu Rev. 1999; 56(3-4): 181.