-
1
-
-
32044467969
-
-
DTPSDS 0003-966X 10.1889/1.1832449.
-
T. Matsumoto, T. Nakada, J. Endo, K. Mori, N. Kavamura, A. Yokoi, and J. Kido, SID Int. Symp. Digest Tech. Papers DTPSDS 0003-966X 10.1889/1.1832449 34, 979 (2003).
-
(2003)
SID Int. Symp. Digest Tech. Papers
, vol.34
, pp. 979
-
-
Matsumoto, T.1
Nakada, T.2
Endo, J.3
Mori, K.4
Kavamura, N.5
Yokoi, A.6
Kido, J.7
-
3
-
-
1242310253
-
-
APPLAB 0003-6951 10.1063/1.1640470.
-
T. Tsutsui and M. Terai, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.1640470 84, 440 (2004).
-
(2004)
Appl. Phys. Lett.
, vol.84
, pp. 440
-
-
Tsutsui, T.1
Terai, M.2
-
4
-
-
9144225109
-
-
JAPNDE 0021-4922 10.1143/JJAP.43.6418.
-
C. C. Chang, S. W. Hwang, C. H. Chen, and J. F. Chen, Jpn. J. Appl. Phys., Part 1 JAPNDE 0021-4922 10.1143/JJAP.43.6418 43, 6418 (2004).
-
(2004)
Jpn. J. Appl. Phys., Part 1
, vol.43
, pp. 6418
-
-
Chang, C.C.1
Hwang, S.W.2
Chen, C.H.3
Chen, J.F.4
-
5
-
-
24644463891
-
-
APPLAB 0003-6951 10.1063/1.2035320.
-
J. X. Sun, X. L. Zhu, H. J. Peng, M. Wong, and H. S. Kwok, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.2035320 87, 093504 (2005).
-
(2005)
Appl. Phys. Lett.
, vol.87
, pp. 093504
-
-
Sun, J.X.1
Zhu, X.L.2
Peng, H.J.3
Wong, M.4
Kwok, H.S.5
-
6
-
-
28344436328
-
-
APPLAB 0003-6951 10.1063/1.2120898.
-
F. Guo and D. Ma, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.2120898 87, 173510 (2005).
-
(2005)
Appl. Phys. Lett.
, vol.87
, pp. 173510
-
-
Guo, F.1
Ma, D.2
-
7
-
-
30344449193
-
-
APPLAB 0003-6951 10.1063/1.2141718.
-
C. W. Chen, Y. J. Lu, C. C. Wu, E. H. E. Wu, C. W. Chu, and Y. Yang, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.2141718 87, 241121 (2005).
-
(2005)
Appl. Phys. Lett.
, vol.87
, pp. 241121
-
-
Chen, C.W.1
Lu, Y.J.2
Wu, C.C.3
Wu, E.H.E.4
Chu, C.W.5
Yang, Y.6
-
8
-
-
29144491814
-
-
APPLAB 0003-6951 10.1063/1.2147730.
-
C. C. Chang, J. F. Chen, S. W. Hwang, and C. H. Chen, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.2147730 87, 253501 (2005).
-
(2005)
Appl. Phys. Lett.
, vol.87
, pp. 253501
-
-
Chang, C.C.1
Chen, J.F.2
Hwang, S.W.3
Chen, C.H.4
-
9
-
-
33645133571
-
-
APPLAB 0003-6951 10.1063/1.2185077.
-
T. Y. Cho, C. L. Lin, and C. C. Wu, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.2185077 88, 111106 (2006).
-
(2006)
Appl. Phys. Lett.
, vol.88
, pp. 111106
-
-
Cho, T.Y.1
Lin, C.L.2
Wu, C.C.3
-
10
-
-
33746072588
-
-
APPLAB 0003-6951 10.1063/1.2219725.
-
H. Kanno, N. C. Giebink, Y. Sun, and S. R. Forrest, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.2219725 89, 023503 (2006).
-
(2006)
Appl. Phys. Lett.
, vol.89
, pp. 023503
-
-
Kanno, H.1
Giebink, N.C.2
Sun, Y.3
Forrest, S.R.4
-
11
-
-
34547883945
-
-
JAPNDE 0021-4922 10.1143/JJAP.45.9219.
-
H. Kanno, Y. Hamada, K. Nishimura, K. Okumoto, N. Saito, H. Ishida, H. Takahashi, K. Shibata, and K. Mameno, Jpn. J. Appl. Phys., Part 1 JAPNDE 0021-4922 10.1143/JJAP.45.9219 45, 9219 (2006).
-
(2006)
Jpn. J. Appl. Phys., Part 1
, vol.45
, pp. 9219
-
-
Kanno, H.1
Hamada, Y.2
Nishimura, K.3
Okumoto, K.4
Saito, N.5
Ishida, H.6
Takahashi, H.7
Shibata, K.8
Mameno, K.9
-
12
-
-
34547952130
-
-
DTPSDS 0003-966X 10.1889/1.2433190.
-
L. S. Liao, K. P. Klubek, M. J. Helber, L. Cosimbescu, and D. L. Comfort, SID Int. Symp. Digest Tech. Papers DTPSDS 0003-966X 10.1889/1.2433190 37, 1197 (2006).
-
(2006)
SID Int. Symp. Digest Tech. Papers
, vol.37
, pp. 1197
-
-
Liao, L.S.1
Klubek, K.P.2
Helber, M.J.3
Cosimbescu, L.4
Comfort, D.L.5
-
13
-
-
34648837363
-
-
APPLAB 0003-6951 10.1063/1.2787877.
-
H. Zhang, Y. Dai, and D. Ma, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.2787877 91, 123504 (2007).
-
(2007)
Appl. Phys. Lett.
, vol.91
, pp. 123504
-
-
Zhang, H.1
Dai, Y.2
Ma, D.3
-
14
-
-
38849157786
-
-
ADVMEW 0935-9648 10.1002/adma.200700454.
-
L. S. Liao, W. K. Slusarek, T. K. Hatwar, M. L. Ricks, and D. L. Dustin, Adv. Mater. (Weinheim, Ger.) ADVMEW 0935-9648 10.1002/adma.200700454 20, 324 (2008).
-
(2008)
Adv. Mater. (Weinheim, Ger.)
, vol.20
, pp. 324
-
-
Liao, L.S.1
Slusarek, W.K.2
Hatwar, T.K.3
Ricks, M.L.4
Dustin, D.L.5
-
15
-
-
38849207962
-
-
APPLAB 0003-6951 10.1063/1.2837419.
-
T. W. Lee, T. Noh, B. K. Choi, M. S. Kim, D. W. Shin, and J. Kido, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.2837419 92, 043301 (2008).
-
(2008)
Appl. Phys. Lett.
, vol.92
, pp. 043301
-
-
Lee, T.W.1
Noh, T.2
Choi, B.K.3
Kim, M.S.4
Shin, D.W.5
Kido, J.6
-
16
-
-
0032505122
-
-
NATUAS 0028-0836 10.1038/25954.
-
M. A. Baldo, D. F. O'Brien, Y. You, A. Shoustikov, S. Sibley, M. E. Thompson, and S. R. Forrest, Nature (London) NATUAS 0028-0836 10.1038/25954 395, 151 (1998).
-
(1998)
Nature (London)
, vol.395
, pp. 151
-
-
Baldo, M.A.1
O'Brien, D.F.2
You, Y.3
Shoustikov, A.4
Sibley, S.5
Thompson, M.E.6
Forrest, S.R.7
-
17
-
-
33644954358
-
-
PRBMDO 0163-1829 10.1103/PhysRevB.72.085220.
-
C. Rothe, S. M. King, and A. P. Monkman, Phys. Rev. B PRBMDO 0163-1829 10.1103/PhysRevB.72.085220 72, 085220 (2005).
-
(2005)
Phys. Rev. B
, vol.72
, pp. 085220
-
-
Rothe, C.1
King, S.M.2
Monkman, A.P.3
-
18
-
-
33748503199
-
-
APPLAB 0003-6951 10.1063/1.2337269.
-
Y. Luo, H. Aziz, Z. D. Popovic, and G. Xu, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.2337269 89, 103505 (2006).
-
(2006)
Appl. Phys. Lett.
, vol.89
, pp. 103505
-
-
Luo, Y.1
Aziz, H.2
Popovic, Z.D.3
Xu, G.4
-
19
-
-
44849117707
-
-
See EPAPS document No. E-APPLAB-92-066822 for carrier injection behaviors of set-C devices and set-D devices. For more information of EPAPS, see: http://www.aiorg/pubservs/epaps.html.
-
See EPAPS document No. E-APPLAB-92-066822 for carrier injection behaviors of set-C devices and set-D devices. For more information of EPAPS, see: http://www.aip.org/pubservs/epaps.html.
-
-
-
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