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Volumn , Issue , 2007, Pages 59-64
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Mechanical characteristics of LTCC (Low Temperature Cofired Ceramics) -tapes for mechanical application
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ARCHITECTURAL DESIGN;
BENDING (DEFORMATION);
BENDING TESTS;
BUILDING MATERIALS;
COMPUTER NETWORKS;
DETECTORS;
ELECTRONIC EQUIPMENT MANUFACTURE;
ELECTRONICS PACKAGING;
FIBER OPTIC SENSORS;
METALLIZING;
PACKAGING;
SEMICONDUCTOR QUANTUM DOTS;
SENSORS;
SPRINGS (COMPONENTS);
TECHNOLOGY;
(PL) PROPERTIES;
APPLIED (CO);
BEAM ELEMENTS;
BENDING STRESSES;
CONFERENCE PROCEEDINGS;
ELECTRONICS TECHNOLOGY;
EMERGING TECHNOLOGIES;
FINITE ELEMENT (FE);
GEOMETRICAL PARAMETERS;
IN ORDER;
INTERNATIONAL (CO);
LOW TEMPERATURE CO-FIRED CERAMIC (LTCC);
MECHANICAL CHARACTERISTICS;
METALLIZATION;
OPERATING SENSORS;
PROCESSING CONDITIONS;
SENSOR SIGNALS;
THICK FILM;
MECHANICAL PROPERTIES;
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EID: 44849106934
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ISSE.2007.4432821 Document Type: Conference Paper |
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Times cited : (8)
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References (1)
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