Development of thin pixel sensors and a novel interconnection technology for the SLHC

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 591, Issue 1, 2008, Pages 229-232

  Macchiolo, A ^a   Andricek, L ^a,b   Beimforde, M ^a   Dubbert, J ^a   Ghodbane, N ^a   Kortner, O ^a   Kroha, H ^a   Moser, H G ^a,b   Nisius, R ^a   Richter, R H ^a,b  

^a MAX PLANCK INSTITUT FÜR PHYSIK   (Germany)

^b MPI HALBLEITERLABOR   (Germany)

Author keywords

3D Interconnections; ICV; Pixel detector; Radiation hardness; SLID

Indexed keywords

INTERDIFFUSION (SOLIDS); PIXELS; RADIATION HARDENING; SILICON COMPOUNDS;

3D INTERCONNECTIONS; ACTIVE THICKNESS; PIXEL DETECTORS;

RADIATION DETECTORS;

EID: 44649173002     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2008.03.064     Document Type: Article

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