Platform wide innovations to overcome thermal challenges

Microelectronics Journal

Volumn 39, Issue 7, 2008, Pages 930-941

  Yavatkar, Raj ^a   Tirumala, Murli ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Acoustic; Packaging; Performance; Thermal

Indexed keywords

FUNCTION EVALUATION; INNOVATION; MARKETING; MATHEMATICAL MODELS;

ARCHITECTURAL TRADEOFFS; ENERGY BUDGET;

ENERGY MANAGEMENT;

EID: 44649136217     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2007.11.019     Document Type: Article

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