-
2
-
-
44649111975
-
-
Y. S. Lee, K. C. Kim, S. D. Park, and J. C. Park, J. Microelectronics & Packaging Society (Korean), 9, 7 (2002).
-
(2002)
J. Microelectronics & Packaging Society (Korean)
, vol.9
, pp. 7
-
-
Lee, Y.S.1
Kim, K.C.2
Park, S.D.3
Park, J.C.4
-
5
-
-
44649124400
-
-
C. J. Lee, H. J. Kim, and S. C. Choi, J. Kor. Ceram. Soc., 37, 302 (2000).
-
(2000)
J. Kor. Ceram. Soc
, vol.37
, pp. 302
-
-
Lee, C.J.1
Kim, H.J.2
Choi, S.C.3
-
6
-
-
44649144723
-
-
S. H. Sim, C. Y. Kang, J. W. Choi, Y. J. Yoon, H. J. Kim, H. W. Choi, and S. J. Yoon, J. Kor. Ceram. Soc., 40, 375 (2003).
-
(2003)
J. Kor. Ceram. Soc
, vol.40
, pp. 375
-
-
Sim, S.H.1
Kang, C.Y.2
Choi, J.W.3
Yoon, Y.J.4
Kim, H.J.5
Choi, H.W.6
Yoon, S.J.7
-
10
-
-
44649128119
-
-
Japanese Patent 041966
-
Y. Satsuu, S. Amo, A. Takahishi, N. Watabe, M. Unno, T. Fujieda, H. Akaboshi, and A. Nagai, Japanese Patent 041966 (2005).
-
(2005)
-
-
Satsuu, Y.1
Amo, S.2
Takahishi, A.3
Watabe, N.4
Unno, M.5
Fujieda, T.6
Akaboshi, H.7
Nagai, A.8
-
13
-
-
0030145479
-
-
A. Deutsch et al., IEEE Trans. Components, Packaging, and Manufacturing Technology-PartB, 19, 331 (1996).
-
A. Deutsch et al., IEEE Trans. Components, Packaging, and Manufacturing Technology-PartB, 19, 331 (1996).
-
-
-
-
17
-
-
26444565709
-
-
J. N. Suman, J. Kathi, and S. Tammishetti, Eur. Polym. J., 41, 2963 (2005).
-
(2005)
Eur. Polym. J
, vol.41
, pp. 2963
-
-
Suman, J.N.1
Kathi, J.2
Tammishetti, S.3
-
18
-
-
0038700487
-
-
Y. S. Kim, H. S. Min, and S. C. Kim, Macromol. Res., 10, 60 (2002).
-
(2002)
Macromol. Res
, vol.10
, pp. 60
-
-
Kim, Y.S.1
Min, H.S.2
Kim, S.C.3
-
19
-
-
24344456689
-
-
I. B. Recalde, D. Recalde, R. Garcia-Lopera, and C. M. Gomez, Eur. Polym. J., 41, 2635 (2005).
-
(2005)
Eur. Polym. J
, vol.41
, pp. 2635
-
-
Recalde, I.B.1
Recalde, D.2
Garcia-Lopera, R.3
Gomez, C.M.4
-
20
-
-
44649153051
-
-
S. Sase, Y. Mizuno, D. Fujimoto, and M. Nomoto, J. Network Polymer (Japanese), 22, 150 (2001).
-
(2001)
J. Network Polymer (Japanese)
, vol.22
, pp. 150
-
-
Sase, S.1
Mizuno, Y.2
Fujimoto, D.3
Nomoto, M.4
-
21
-
-
44649134057
-
-
S. Sase, Y. Mizuno, D. Fujimoto, and M. Nomoto, J. Network Polymer(Japanese), 22, 192 (2001).
-
(2001)
J. Network Polymer(Japanese)
, vol.22
, pp. 192
-
-
Sase, S.1
Mizuno, Y.2
Fujimoto, D.3
Nomoto, M.4
-
22
-
-
44649128711
-
-
S05-2-1
-
S. Sase, Y. Mizuno, D. Fujimoto, N. Takano, T. Iijima, H. Negishi, and T. Sugimura, Proc. of IPC Printed Circuits Expo 2002, S05-2-1 (2002).
-
(2002)
Proc. of IPC Printed Circuits Expo 2002
-
-
Sase, S.1
Mizuno, Y.2
Fujimoto, D.3
Takano, N.4
Iijima, T.5
Negishi, H.6
Sugimura, T.7
-
23
-
-
44649192549
-
-
D. Fujimoto, Y. Mizuno, N. Takano, S. Sase, H. Negishi, and T. Sugimura, Proc. of IEEE Polytronic 2002 Conference, 114 (2002).
-
(2002)
Proc. of IEEE Polytronic 2002 Conference
, vol.114
-
-
Fujimoto, D.1
Mizuno, Y.2
Takano, N.3
Sase, S.4
Negishi, H.5
Sugimura, T.6
-
24
-
-
44649115950
-
-
Y. Mizuno, D. Fujimoto, N. Takano, S. Sase, T. Iijima, H. Negishi, and T. Sugimura, Proc. of the 38th IMAPS Nordic Conference, 35 (2001).
-
(2001)
Proc. of the 38th IMAPS Nordic Conference
, vol.35
-
-
Mizuno, Y.1
Fujimoto, D.2
Takano, N.3
Sase, S.4
Iijima, T.5
Negishi, H.6
Sugimura, T.7
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