The RELAXd project: Development of four-side tilable photon-counting imagers

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 591, Issue 1, 2008, Pages 241-244

  Vykydal, Zdenek ^a,b,c   Visschers, Jan ^b   Tezcan, Deniz Sabuncuoglu ^c   De Munck, Koen ^c   Borgers, Tom ^c   Ruythooren, Wouter ^c   De Moor, Piet ^c  

^a CZECH TECHNICAL UNIVERSITY IN PRAGUE   (Czech Republic)

^b NIKHEF   (Netherlands)

^c IMEC   (Belgium)

Author keywords

Medipix; Through silicon via; Wafer postprocessing; X ray imaging

Indexed keywords

IMAGE ANALYSIS; NEUTRONS; PHOTONS; X RAY ANALYSIS;

THROUGH SILICON VIA; WAFER POSTPROCESSING; X-RAY IMAGING;

IMAGING SYSTEMS;

EID: 44649109478     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2008.03.099     Document Type: Article

References (7)

1. Web presentation of the Medipix Collaboration at 〈http://www.cern.ch/medipix〉.
2. San Segundo Bello D., Van Beuzekom M., Jansweijer P., Verkooijen H., and Visschers J. Nucl. Instr. and Meth. A 509 (2003) 164
3. Vykydal Z., Jakubek J., and Pospisil S. Nucl. Instr. and Meth. A 563 (2006) 112
4. Fornaini A., Boerkamp T., de Oliveira R., and Visschers J.L. Nucl. Instr. and Meth. A 509 (2003) 206
5. Fornaini A., Boerkamp T., de Oliveira R., and Visschers J.L. IEEE Trans. Nucl. Sci. 51 4, part 1 (2004) 1824
6. Tezcan D.S., Pham N., Majeed B., De Moor P., Ruythooren W., and Baert K. Sloped through wafer vias for 3D wafer level packaging. Proceedings of the Electronic Components and Technology Conference, May (2007) 643-647
7. J.H.R. Schrader, E.A.M. Klumperink, J.L. Visschers, B. Nauta, Wireline equalization using pulse-width modulation, in: Proceedings of the IEEE Custom Integrated Circuits Conference (CICC), September 2006, pp. 591-598.