Effects of Ga on properties of Sn-9Zn lead-free solder

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 29, Issue 4, 2008, Pages 37-40

  Chen, Wenxue ^a   Xue, Songbai ^a   Wang, Hui ^a   Han, Zongjie ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Ga; Lead free solder; Mechanical properties; Melting characteristics; Wetting properties

Indexed keywords

ADDITIVES; GRAIN BOUNDARIES; MECHANICAL PROPERTIES; MICROSTRUCTURE; SOLDERED JOINTS; WETTING;

GA; LEAD FREE SOLDER; MELTING CHARACTERISTICS; WETTING PROPERTIES;

MELTING POINT;

EID: 44449136047     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)