Curing kinetics and thermal property characterization of an o-cresol formaldehyde epoxy resin and 4,4′ -diaminodiphenyl ether system

Journal of Applied Polymer Science

Volumn 94, Issue 1, 2004, Pages 182-188

  Gao, Jungang ^a   Zhao, Min ^a  

^a HEBEI UNIVERSITY   (China)

Author keywords

Glass transition; Kinetics; Resins; Thermal properties

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; ETHERS; FORMALDEHYDE; FOURIER TRANSFORM INFRARED SPECTROSCOPY; GLASS TRANSITION; PYROLYSIS; RATE CONSTANTS;

MOLECULAR CHAINS; STRUCTURAL ADHESIVES; THERMAL DEGRADATION KINETICS;

EPOXY RESINS;

POLYMER SCIENCE;

EID: 4444348516     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.20853     Document Type: Article

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