A methodology to assess microprocessor fan reliability

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 96-101

  Sidharth, ^a   Sundaram, Sridhar ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

Accelerated test; Acceleration model; Failure; Field life; Microprocessor fan; Reliability; Sample size; Weibull distribution; Zero fails

Indexed keywords

ACCELERATED TEST; ACCELERATION MODEL; FAILURE; MICROPROCESSOR FAN;

DATA REDUCTION; MATHEMATICAL MODELS; MICROELECTRONIC PROCESSING; PROBABILITY; RELIABILITY; WEIBULL DISTRIBUTION;

MICROPROCESSOR CHIPS;

EID: 4444345892     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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5. th Ave, New York
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