Packaging image sensor devices for camera module applications

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 18-27

  Darveaux, Robert ^a   Chowdhury, Asif ^a   Tome, Jay ^a   Schoonejongen, Ron ^a   Reifel, Mitch ^a   De Guzman, Archie ^a   Park, Sung Soon ^b  

^a AMKOR TECHNOLOGY   (United States)

^b Amkor Technology Korea Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DIGITAL STILL CAMERAS; MOBILE PHONES; PARTICLE CONTAMINATION;

CAMERAS; DIGITAL FILTERS; IMAGE SENSORS; INTEGRATED CIRCUITS; LENSES; MOBILE TELECOMMUNICATION SYSTEMS;

ELECTRONICS PACKAGING;

EID: 4444313219     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Shellcase, IC Packaging Technology Expo, January, 2003.