Performance of powder injection molding (PIM) heat sink

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 451-454

  Tan, Lye King ^a   Ma, Jan ^b  

^a Adv Materials Technologies Pte Ltd   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Aluminum; Fine grained microstructure; Heatsink; Powder injection molding; Thermal property

Indexed keywords

FINE-GRAINED MICROSTRUCTURE; POWDER INJECTION MOLDING;

ALUMINUM; COMPUTER SIMULATION; GRAIN SIZE AND SHAPE; HEAT LOSSES; INJECTION MOLDING; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SINTERING; TENSILE STRENGTH; THERMAL CONDUCTIVITY; THERMAL EFFECTS; TOUGHNESS;

HEAT SINKS;

EID: 4444308065     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. R.M. German, Powder Injection Molding, Design & Applications, User's Guide, 2003.
2. E. M. Daver, W. J. Ullrich and K. B. Patel, Key Engineering Materials, 29-31 (1989) p401-428.
3. Lye-King Tan, J. Ma, "Characterisation of Powder Injection Molded Aluminum (aluMIM)", Proceedings of the 2003 International Conference on Powder Metallurgy & Particulate Materials, June 8-12, Las Vegas, NV, Part 8, p282.
4. T. M. Yue, H. U. Ha and N. J. Musson, Journal of Materials Science, 30 (1995) p2277-2283.