Electrically anisotropic conductive adhesives: A new model for conduction mechanism

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 163-168

  Shi, F G ^a   Abdullah, M ^b,d   Chungpaiboonpatana, S ^a   Okuyama, K ^b   Davidson, C ^c   Adams, J M ^c  

^a University of California at Irvine   (United States)

^b HIROSHIMA UNIVERSITY   (Japan)

^c Rockwell Semiconductor Systems   (United States)

^d BANDUNG INSTITUTE OF TECHNOLOGY   (Indonesia)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; ANISOTROPY; INTERFACES (MATERIALS); PARTICLE SIZE; PARTICLE SIZE ANALYSIS;

ANISOTROPIC CONDUCTIVE ADHESIVES; APPLIED FORCES; CONDUCTION MECHANISM; FORCE RESISTANCE; UNIVERSAL POWER LAW;

PACKAGING MATERIALS;

EID: 4444301669     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757305     Document Type: Conference Paper

References (8)

1. M. A. Gaynes, R. H. Lewis, R. F. Sard, and J. M. Roldan, IEEE Trans. Comp. Packag. Manufact. Tecnol. B 18, 299 (1995).
2. Z. Lai and J. Liu, WEE Trans. Comp. Packag. Manufact. Tecnol. B 19, 644 (1996).
3. A. Mikrajuddin, F.G. Shi, S. Chungpaiboonpatana, K. Okuyama, C. Davidson, and J. M. Adams (unpublished).
4. G. R. Ruschau, S. Yoshikawa, and R. E. Newnhan, J. Appl. Phys. 72, 953 (1992).
5. W. R. Lambert, J. P. Mutchel, J. A. Suchman, and J. A. Fulton, 39th Electronic Components Conference, Houston, Texas, p. 99-106 (1989).
6. J. A. Fulton, D. R. Horton, R. C. Moore, W. R. Lambert, S. Jin, R. L. Opila, R. C. Sherwood, T. H. Tiefel, and J. J. Mottine, 39th Electronic Components Conference, Houston, Texas, p. 71-77 (1989).
7. R. Holm, Electric Contacts, Berlin: Springer- Verlag (1967).
8. F. L. Jones, The Physics of Electrical Contacts, Oxford: Clarendon Press (1957).