Design optimization and reliability of PWB level electronic package

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 368-376

  Jagarkal, Sudhakar G ^a   Hossain, Mohammad Masum ^a   Agonafer, Dereje ^a   Lulu, Menberu ^b   Reh, Stefan ^c  

^a UNIVERSITY OF TEXAS AT ARLINGTON   (United States)

^b HOWARD UNIVERSITY   (United States)

^c ANSYS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC PRODUCTS; THERMAL CYCLE LOADING; THERMAL MANAGEMENT STRATEGIES;

CYCLIC LOADS; ELECTRIC INDUSTRY; FABRICATION; OPTIMIZATION; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; THERMAL CYCLING; THERMAL EXPANSION; THERMAL STRESS;

ELECTRONICS PACKAGING;

EID: 4444243424     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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