Substantiation of numerical analysis methodology for CPU package with non-uniform heat dissipation and heat sink with simplified fin modeling

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 537-542

  Gektin, Vadim ^a   Zhang, Ron ^a   Vogel, Marlin ^a   Xu, Guoping ^a   Lee, Mario ^a  

^a SUN MICROSYSTEMS   (United States)

Author keywords

Airflow; Heat sink; Modeling; Thermal characterization; Vapor chamber

Indexed keywords

AIRFLOW; JUNCTION TEMPERATURE; THERMAL CHARACTERIZATION; VAPOR CHAMBER;

COMPUTATIONAL GEOMETRY; COMPUTATIONAL METHODS; DATA ACQUISITION; HEAT FLUX; HEAT SINKS; HEAT TRANSFER; NUMERICAL METHODS; THERMAL CONDUCTIVITY; THERMOANALYSIS; VAPORS;

HEAT LOSSES;

EID: 4444231021     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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