A miniaturized LTCC multi-layered front-end module for dual band WLAN (802.11a/b/g) applications

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 2004, Pages 563-566

  Ko, Young Joon ^a   Park, Jae Yeong ^a   Ryu, Jin Hyung ^a   Lee, Kyeong Hak ^a   Bu, Jong Uk ^a  

^a LG Electronics Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMMERCIAL PRODUCTS; FRONT-END MODULE (FEM);

ANTENNAS; BANDPASS FILTERS; BANDWIDTH; DIRECTIONAL PATTERNS (ANTENNA); FABRICATION; PRINTED CIRCUIT BOARDS; TRANSCEIVERS; WIRELESS TELECOMMUNICATION SYSTEMS;

LOCAL AREA NETWORKS;

EID: 4444228942     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. K. Lim, A. Obatoyinbo, and J. Laskar, et al, "A Highly Integrated Tranceiver Module for 5.8GHz OFDM Communication System using Multi-layer Packaging Technology", IEEE International Conf. on Microwave and Millimeter Wave Tech. Proceedings, pp. 1739-1742, 2001.
2. C. H. Lee, Chakraborty, and J. Laskar, et al, "Broadband Highly Integrated LTCC Front-end Module for IEEE 802.1 la WLAN Applications", IEEE MTT-S Dig., pp. 1045-1048, 2002.
3. S. Pinel, Chakraborty, and J. Laskar, et al, "3D integrated LTCC module using μBGA technology for compact C-band RF front-end module", IEEE MTT-S Dig., pp. 1553-1556, 2002.
4. Cheryl Ajluni, "Combo Chip Set Dials in Much-Needed Functionality", Wireless System Design, pp.17-19, April,2002.
5. Jyh-Wen Sheen and Chiang-Wen, "LTCC-MLC Balun for WLAN/Bluetooth", IEEE MTT-S Dig., pp. 315-318, 2001.
6. C.W. Tang and C.Y. Chang, "LTCC-MLC chip-type balun by LC resonance method", Electronics Letters, vol. 38, pp. 519-520, May, 2002.