One-dimensional analysis of thermoelectric modules

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 242-250

  Hodes, Marc ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SEEBECK COEFFICIENTS; THERMOELECTRIC MODULES (TM); VOLTAGE DISTRIBUTIONS;

BOUNDARY CONDITIONS; ELECTRIC CONDUCTIVITY; HEAT CONDUCTION; INTERFACES (MATERIALS); REFRIGERATION; REFRIGERATORS; THERMAL CONDUCTIVITY; THERMOCOUPLES;

THERMOELECTRICITY;

EID: 4444226929     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. C. L. Foiles, "Thermoelectric effects," in Encyclopedia of Physics, 2nd ed., R. G. Lerner and G. L. Trigg, Eds. New York: VCH Publishers, INC., 1991, pp. 1263,1264.
2. J. S. Ishay, V. Pertsis, E. Rave, A. Goren, and D. J. Bergman, "Natural thermoelectric heat pump in social wasps," Physical Review Letters, vol. 90, no. 21, 2003.
3. Melcor Thermal Solutions, Melcor Corporation, Trenton, NJ, 2002.
4. H. J. Goldsmid, Electronic Refrigeration. Great Britain: Pion Limited, 1986.
5. A. D. Kraus and A. Bar-Cohen, Thermal Analysis and Control of Electronic Equipment. McGraw-Hill, 1983.
6. M. J. Ellsworth and R. E. Simons, "Analysis of a thermoelectric cooler with non-uniform heating," in Proc. Int. Mech. Eng. Exposition and Conf. Orlando, FL: ASME, November 2000.