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Volumn 31, Issue 1, 2005, Pages 28-40
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Immersion tin: A proven final finish for printed circuit boards providing reliable solderability and marginal formation of tin-whiskers
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Author keywords
Printed circuit boards; Process management; Surface treatment
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Indexed keywords
IMMERSION TIN PLATING;
PROCESS MANAGEMENT;
SOLDERABILITY TESTING;
TIN WHISKERS;
CRYSTAL WHISKERS;
SEMICONDUCTING TIN COMPOUNDS;
SOLDERING;
SURFACE TREATMENT;
TESTING;
THICKNESS MEASUREMENT;
TINNING;
PRINTED CIRCUIT BOARDS;
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EID: 4444224520
PISSN: 03056120
EISSN: None
Source Type: Journal
DOI: 10.1108/03056120510553202 Document Type: Article |
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Times cited : (3)
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References (0)
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