A novel EBG power plane with stopband enhancement using artificial substrate

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2007, Pages 193-196

  Wang, Ting Kuang ^a   Han, Tzu Wei ^a   Wu, Tzong Lin ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; RESONANCE; SUBSTRATES; TELECOMMUNICATION SYSTEMS;

AIR RODS; ARTIFICIAL SUBSTRATES; DISPERSION DIAGRAMS; GROUND BOUNCES; LINE MODELS; POWER PLANES; RESONANCE FREQUENCIES; STOP BANDS;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 44049097258     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2007.4387158     Document Type: Conference Paper

References (3)

1. R. Abhari, and G. V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits," IEEE Trans. Microwave Theory & Tech., vol. 51, pp. 1629-1639, June 2003.
2. Tzong-Lin Wu, Yen-Hui Lin, Ting-Kuang Wang, Chien-Chung Wang, and Sin-Ting Chen, "Electromagnetic Bandgap Power/Ground Planes for Wideband Suppression of Ground Bounce Noise and Radiated Emission in High-Speed Circuits", IEEE Trans. Microwave Theory and Tech., vol. 53, No.9, pp. 2935-2942, Sept. 2005.
3. Tzong-Lin Wu and Sin-Ting Chen, "A Photonic Crystal Power/Ground Layer for Eliminating Simultaneously Switching Noise in High-Speed Circuit", IEEE Trans. Microwave Theory and Tech., vol. 54, No.8, pp. 3398-3406, Aug 2006.