Dynamic amorphization and recrystallization of metals in kinetic spray process

Applied Physics Letters

Volumn 92, Issue 19, 2008, Pages

  Xiong, Yuming ^a   Kang, Kicheol ^a   Bae, Gyuyeol ^a   Yoon, Sanghoon ^a   Lee, Changhee ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHIZATION; INTERFACES (MATERIALS); METALS; RECRYSTALLIZATION (METALLURGY); SPRAYING; STRAIN RATE;

DUCTILE JOINTS; KINETIC SPRAY PROCESS; SHEAR INSTABILITY;

PHASE TRANSITIONS;

EID: 44049094162     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2928218     Document Type: Article

References (21)

1. A. P. Alkhimov, V. F. Kosarev, N. I. Nesterovich, and A. N. Papyrin, Method of applying coatings, Russian Patent No. 1,618,778 (8 September 1990).
2. A. P. Alkhimov, A. N. Papyrin, V. F. Kosarev, N. I. Nesterovich, and M. M. Shushpanov, U.S. Patent No. 5,302,414 (12 April 1994).
3. W. B. Choi, L. Li, V. Luzin, R. Neiser, T. Gnäupel-Herold, H. J. Prask, S. Sampath, and A. Gouldstone, Acta Mater. ACMAFD 1359-6454 10.1016/j.actamat.2006.09.006 55, 857 (2007).
4. T. Schmidt, F. Gärtner, H. Assadi, and H. Kreye, Acta Mater. ACMAFD 1359-6454 10.1016/j.actamat.2005.10.005 54, 729 (2006).
5. H. Assdi, F. Gärtner, T. Stoltenhoff, and H. Kreye, Acta Mater. ACMAFD 1359-6454 10.1016/S1359-6454(03)00274-X 51, 4379 (2003).
6. C. Borchers, F. Gartner, T. Stoltenhoff, and H. Kreye, J. Appl. Phys. JAPIAU 0021-8979 10.1063/1.1789278 96, 4288 (2004).
7. H. Ikeda, Y. Qi, T. Cagin, K. Samwer, W. L. Johnson, and W. A. Goddard, Phys. Rev. Lett. PRLTAO 0031-9007 10.1103/PhysRevLett.82.2900 82, 2900 (1999).
8. P. S. Branicio and J. P. Rino, Phys. Rev. B PRBMDO 0163-1829 10.1103/PhysRevB.62.16950 62, 16950 (2000).
9. M. F. Ashby and D. R. H. Jones, Engineering Materials 2, An Introduction to Microstructures, Processing and Design, 2nd ed. (Pergamon, Oxford, 1998).
10. J. Li, Z. Q. Jin, J. P. Liu, Z. L. Wang, and N. N. Thadhani, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.1790600 85, 2223 (2004).
11. T. Irifune, K. Kuroda, N. Funamori, T. Uchida, T. Yagi, T. Inoue, and N. Miyajima, Science SCIEAS 0036-8075 10.1126/science.272.5267.1468 272, 1468 (1996).
12. P. R. Okamoto, J. K. Heuer, N. Q. Lam, S. Ohnuki, Y. Matsukawa, K. Tozawa, and J. F. Stubbins, Appl. Phys. Lett. APPLAB 0003-6951 10.1063/1.121904 73, 473 (1998).
13. M. Chen, J. W. McCauley, and K. J. Hemker, Science SCIEAS 0036-8075 10.1126/science.1080819 299, 1563 (2003).
14. E. Ma, Scr. Mater. SCMAF7 1359-6462 10.1016/S1359-6462(03)00477-9 49, 941 (2003).
15. J. Zhang and Y. Zhao, Nature (London) NATUAS 0028-0836 10.1038/nature02715 430, 332 (2004).
16. S. H. Yoon, C. Lee, H. S. Choi, and H. G. Jo, Mater. Sci. Eng., A MSAPE3 0921-5093 10.1016/j.msea.2005.08.132 415, 45 (2006).
17. J. Wu, H. Fang, S. Yoon, H. Kim, and C. Lee, Appl. Surf. Sci. ASUSEE 0169-4332 10.1016/j.apsusc.2005.02.108 252, 1368 (2005).
18. P. Cordier, J. C. Doukhan, and J. Peyronneau, Phys. Chem. Miner. PCMIDU 0342-1791 10.1007/BF00200120 20, 176 (1993).
19. R. M. Lynden-Bell, J. Phys.: Condens. Matter JCOMEL 0953-8984 10.1088/0953-8984/7/24/003 7, 4603 (1995).
20. A. A. Valladare, R. M. Valladares, and A. Calles, MRS Symposia Proceedings No. 848 (Materials Research Society, Warrendale, PA, 2005), FF9.29.1.
21. J. Vlcek, L. Gimeno, H. Huber, and E. Lugscheider, J. Therm. Spray Technol. JTTEE5 1059-9630 10.1361/10599630522738 14, 125 (2005).