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Volumn 21, Issue 2, 2008, Pages 272-277

Classification of defect clusters on semiconductor wafers via the hough transformation

Author keywords

Defect metrology; Hough transformation; Image processing; Process control; Spatial defect analysis and classification; Wafer maps

Indexed keywords

CRYSTAL DEFECTS; IMAGE CLASSIFICATION; MATHEMATICAL TRANSFORMATIONS; PROCESS CONTROL;

EID: 43849110270     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2008.2000269     Document Type: Conference Paper
Times cited : (28)

References (20)
  • 1
    • 0034245675 scopus 로고    scopus 로고
    • A neural-network approach to recognize defect spatial pattern in semiconductor fabrication
    • F.-L. Chen and S.-F. Liu, "A neural-network approach to recognize defect spatial pattern in semiconductor fabrication," IEEE Trans. Semi-conduct. Manuf., vol. 13, pp. 366-373, 2000.
    • (2000) IEEE Trans. Semi-conduct. Manuf , vol.13 , pp. 366-373
    • Chen, F.-L.1    Liu, S.-F.2
  • 2
    • 0032403599 scopus 로고    scopus 로고
    • Rapid yield learning through optical defect and electrical test analysis
    • S. S. Gleason, K. W. Tobin, T. P. Karnowski, and F. Lakhani. "Rapid yield learning through optical defect and electrical test analysis," Proc. SPIE, vol. 3332, pp. 232-242, 1998.
    • (1998) Proc. SPIE , vol.3332 , pp. 232-242
    • Gleason, S.S.1    Tobin, K.W.2    Karnowski, T.P.3    Lakhani, F.4
  • 3
    • 0032083819 scopus 로고    scopus 로고
    • Use of wafer maps in integrated circuit manufacturing
    • C. K. Hansen and P. Thyregod, "Use of wafer maps in integrated circuit manufacturing,"Microelectron. Rel., vol. 38, pp. 1155-1164, 1998.
    • (1998) Microelectron. Rel , vol.38 , pp. 1155-1164
    • Hansen, C.K.1    Thyregod, P.2
  • 5
    • 0032624345 scopus 로고    scopus 로고
    • The application of spatial signature analysis to electrical test data: Validation study
    • T. P. Karnowski, K. W. Tobin, S. S. Gleason, and F. Lakhani, "The application of spatial signature analysis to electrical test data: Validation study," in Proc. SPIE, 1999, vol. 3677, pp. 530-541.
    • (1999) Proc. SPIE , vol.3677 , pp. 530-541
    • Karnowski, T.P.1    Tobin, K.W.2    Gleason, S.S.3    Lakhani, F.4
  • 6
    • 0025844692 scopus 로고
    • Using full wafer defect maps as process signatures to monitor and control yield
    • R. Ken, S. Brain, and H. Neil, "Using full wafer defect maps as process signatures to monitor and control yield," in Proc. IEEE Semiconductor Manufacturing Science Symp., 1991, pp. 129-135.
    • (1991) Proc. IEEE Semiconductor Manufacturing Science Symp , pp. 129-135
    • Ken, R.1    Brain, S.2    Neil, H.3
  • 7
    • 0001439064 scopus 로고    scopus 로고
    • Automatic classification of spatial signatures on semiconductor wafermaps
    • K. W. Tobin, S. S. Gleason, T. P. Karnowski, S. L. Cohen, and F. Lakhani, "Automatic classification of spatial signatures on semiconductor wafermaps," Proc. SPIE., vol. 3050, pp. 434-444, 1997.
    • (1997) Proc. SPIE , vol.3050 , pp. 434-444
    • Tobin, K.W.1    Gleason, S.S.2    Karnowski, T.P.3    Cohen, S.L.4    Lakhani, F.5
  • 8
    • 23744438044 scopus 로고    scopus 로고
    • A new rule-based clustering technique for defect analysis
    • N. G. Shankar and Z. W. Zhong, "A new rule-based clustering technique for defect analysis," Microelectron. J., vol. 36, pp. 718-724, 2005.
    • (2005) Microelectron. J , vol.36 , pp. 718-724
    • Shankar, N.G.1    Zhong, Z.W.2
  • 9
    • 33750830235 scopus 로고    scopus 로고
    • Model-based clustering for integrated circuit yield enhancement
    • J. Y. Hwang and W. Kuo, "Model-based clustering for integrated circuit yield enhancement." Eur. J. Oper. Res., vol. 178, pp. 143-153, 2007.
    • (2007) Eur. J. Oper. Res , vol.178 , pp. 143-153
    • Hwang, J.Y.1    Kuo, W.2
  • 10
    • 33750132385 scopus 로고    scopus 로고
    • Detection and classification of defect patterns on semiconductor wafers
    • C. H. Wang, W. Kuo, and H. Bensmail, "Detection and classification of defect patterns on semiconductor wafers," Trans. Inst. Elect. Eng., vol. 39, pp. 1059-1068, 2006.
    • (2006) Trans. Inst. Elect. Eng , vol.39 , pp. 1059-1068
    • Wang, C.H.1    Kuo, W.2    Bensmail, H.3
  • 11
    • 37449030477 scopus 로고    scopus 로고
    • A model-based clustering approach to the recognition of the spatial defect patterns produced during semiconductor fabrication
    • T. Yuan and W. Kuo, "A model-based clustering approach to the recognition of the spatial defect patterns produced during semiconductor fabrication," Trans. Inst. Elect. Eng., vol. 40, pp. 93-101, 2008.
    • (2008) Trans. Inst. Elect. Eng , vol.40 , pp. 93-101
    • Yuan, T.1    Kuo, W.2
  • 12
    • 43849091154 scopus 로고    scopus 로고
    • Defect clustering for semiconductor devices
    • unpublished
    • B. Kundu, C. M. Mastrangelo, and K. P. White, Jr, "Defect clustering for semiconductor devices," , unpublished.
    • Kundu, B.1    Mastrangelo, C.M.2    White Jr, K.P.3
  • 13
    • 43849109505 scopus 로고    scopus 로고
    • B. Kundu, Defect Clustering and Classification for Semiconductor Devices, M.S. thesis, Univ. Virginia, Charlottesville, 2002.
    • B. Kundu, "Defect Clustering and Classification for Semiconductor Devices," M.S. thesis, Univ. Virginia, Charlottesville, 2002.
  • 16
    • 0031200533 scopus 로고    scopus 로고
    • Monitoring wafer map data from integrated circuit fabrication processes for spatially clustered defects
    • M. H. Hansen, V. N. Nair, and D. J. Friedman, "Monitoring wafer map data from integrated circuit fabrication processes for spatially clustered defects," Technometrics, vol. 39, pp. 241-253, 1997.
    • (1997) Technometrics , vol.39 , pp. 241-253
    • Hansen, M.H.1    Nair, V.N.2    Friedman, D.J.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.