Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry

Journal of Materials Processing Technology

Volumn 203, Issue 1-3, 2008, Pages 287-292

  Park, Boumyoung ^a   Lee, Hyunseop ^a   Park, Kihyun ^a   Kim, Hyoungjae ^b   Jeong, Haedo ^a  

^a Pusan National University   (South Korea)

^b Korea Institute of Industrial Technology   (South Korea)

Author keywords

Ceria slurry; Chemical mechanical polishing; Material removal; Pad roughness

Indexed keywords

CHEMICAL MECHANICAL POLISHING; MATERIALS HANDLING; REMOVAL; SLURRIES; SURFACE ROUGHNESS;

CERIA SLURRY; MATERIAL REMOVAL; PAD ROUGHNESS;

CERIUM COMPOUNDS;

EID: 43849100132     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2007.10.033     Document Type: Article

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