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Volumn 5, Issue 2, 2008, Pages 115-126
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Toward increasing FPGA lifetime
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Author keywords
Electro migration; FPGA; Hot carrier effects; Negative bias temperature instability; Time dependent dielectric breakdown
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Indexed keywords
ELECTRIC BREAKDOWN;
ELECTROMIGRATION;
HOT CARRIERS;
THERMAL EFFECTS;
NEGATIVE BIAS TEMPERATURE INSTABILITY;
TIME-DEPENDENT DIELECTRIC BREAKDOWN;
FIELD PROGRAMMABLE GATE ARRAYS (FPGA);
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EID: 43649083559
PISSN: 15455971
EISSN: None
Source Type: Journal
DOI: 10.1109/TDSC.2007.70235 Document Type: Article |
Times cited : (72)
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References (28)
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