Mechanical and microstructural evolution of Hi-Nicalon Trade Mark SiC fibers annealed in O2-H2O-Ar atmospheres

Materials Science and Engineering: A

Volumn 487, Issue 1-2, 2008, Pages 424-430

  Li, Siwei ^a   Feng, Zude ^a   Mei, Hui ^b   Zhang, Litong ^b  

^a XIAMEN UNIVERSITY   (China)

^b NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

Fracture surface; Hi Nicalon fiber; Microstructure; Passive film; Tensile strength

Indexed keywords

ANNEALING; FILM THICKNESS; FRACTURE; MECHANICAL PROPERTIES; MICROSTRUCTURAL EVOLUTION; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; TENSILE STRENGTH; TENSILE TESTING; TRANSMISSION ELECTRON MICROSCOPY;

ANNEALING TEMPERATURE; FRACTURE SURFACE; PASSIVE FILM; RESIDUAL TENSILE STRENGTH;

SILICON CARBIDE;

ANNEALING; FILM THICKNESS; FRACTURE; MECHANICAL PROPERTIES; MICROSTRUCTURAL EVOLUTION; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; TENSILE STRENGTH; TENSILE TESTING; TRANSMISSION ELECTRON MICROSCOPY;

EID: 43549095249     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.10.035     Document Type: Article

References (29)