Reaction diffusion characteristics at interface of copper/aluminium friction weld

Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 64, Issue 618, 1998, Pages 494-499

  Itoh, Yoshiyasu ^a   Shindoh, Takahiko ^a   Saitoh, Masahiro ^a   Tezuka, Masaru ^a  

^a NONE

Author keywords

Aluminium; Copper; Friction weld; Interface; Intermetallic compound; Reaction diffusion

Indexed keywords

EID: 4344712122     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.64.494     Document Type: Article

References (8)

1. Kidson, G. V., Some aspects of the growth of diffusion layers in binary systems, J. Nucl. Mater., 3-1 (1961), 21-29.