A comparison of methods for in-chip overlay control at the 65 nm node

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5375, Issue PART 1, 2004, Pages 384-394

  Robinson, John C ^a   Stakely, Mark ^a   Poplawski, Jorge M ^a   Izikson, Pavel ^a   Kassel, Elyakim ^a   Adel, Mike E ^a  

^a KLA TENCOR CORPORATION   (United States)

Author keywords

In chip; Metrology; Overlay; Pattern placement error; Process control

Indexed keywords

BOX IN BOX TYPE (BIB); IN-CHIP PATTERN PLACEMENT ERROR; OVERLAY MARK FIDELITY (OMF);

ACOUSTIC NOISE; DATA REDUCTION; ERROR ANALYSIS; IMAGE ANALYSIS; LITHOGRAPHY; PATTERN RECOGNITION;

PROCESS CONTROL;

EID: 4344691664     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.534510     Document Type: Conference Paper

References (3)

1. "Impact of Lens Aberrations on Optical Lithography", T. A. Brunner, p.1, Olin Interface 1996.
2. "An improved method to determine optimal sampling layouts", S. Chang, S. DeMoor, J. Brown, C. Atkinson, J. Roberge, Proc. of SPIE, Microlithography Vol. 5038 (2003), 70-80
3. "Characterization of Overlay Mark Fidelity" Mike Adel, Mark Ghinovker, Jorge Poplawski, Elyakim Kassel, Pavel Izikson, Ivan Pollentier, Philippe Leray & David Laidler, Proc. of SPIE, Microlithography Vol. 5038 (2003), 70-80