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Volumn 114, Issue 2-3, 2004, Pages 387-391
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Thermal design modifications to improve firing frequency of back shooting inkjet printhead
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Author keywords
Backshooter inkjet; Inkjet printhead; Lumped element modeling; Thermal design
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Indexed keywords
CHIP SCALE PACKAGES;
COST EFFECTIVENESS;
DROP BREAKUP;
FREQUENCIES;
HEAT LOSSES;
KINETIC ENERGY;
MANUFACTURE;
THERMAL CONDUCTIVITY;
THIN FILMS;
VAPORS;
BACKSHOOTER INKJET;
INKJET PRINTHEAD;
LUMPED ELEMENT MODELING;
THERMAL DESIGN;
MONOLITHIC INTEGRATED CIRCUITS;
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EID: 4344680158
PISSN: 09244247
EISSN: None
Source Type: Journal
DOI: 10.1016/j.sna.2003.11.030 Document Type: Article |
Times cited : (8)
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References (6)
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