Design of composite laminates with low thermal expansion

Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications

Volumn 218, Issue 3, 2004, Pages 201-209

  Bressan, F ^a,c   De Bona, F ^a   Soma A ^b  

^a UNIVERSITY OF UDINE   (Italy)

^b POLITECNICO DI TORINO   (Italy)

^c ATR Colonnella ^*  (Italy)

Author keywords

Coefficient of thermal expansion (CTE); Composite laminate; Dimensional stability

Indexed keywords

COORDINATE MEASURING MACHINES; DIMENSIONAL STABILITY; ELASTIC MODULI; MATRIX ALGEBRA; POISSON RATIO; PROCESS CONTROL; SILICON CARBIDE; THERMAL EXPANSION;

CLASSICAL LAMINATION THEORY; COEFFICIENT OF THERMAL EXPANSION (CTE); INTERFEROMETRIC TECHNIQUES; LAMINATE THICKNESS;

LAMINATED COMPOSITES;

EID: 4344660687     PISSN: 14644207     EISSN: None     Source Type: Journal    
DOI: 10.1243/1464420041579472     Document Type: Article

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