Electrode evaporation and its effects on thermal arc behavior

IEEE Transactions on Plasma Science

Volumn 32, Issue 3 II, 2004, Pages 1352-1361

  Zhang, Jin Ling ^a   Yan, Jiu Dun ^a   Fang, Michael T C ^a  

^a UNIVERSITY OF LIVERPOOL   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT BREAKING ARCS; COMPUTATIONAL FLUID DYNAMICS; COPPER; ELECTRODES; EVAPORATION; MATHEMATICAL MODELS; NOZZLES; PLASMA TORCHES; SUPERSONIC FLOW; THERMODYNAMIC PROPERTIES;

ARC BEHAVIOR; ARC DEVICES; ARC PLASMA; COMPUTATIONAL INVESTIGATION; ELECTRODE VAPORIZATION;

PLASMA DEVICES;

EID: 4344643875     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPS.2004.827606     Document Type: Article

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