EMC characterization and process study for electronics packaging

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 454-458

  Liu, S L ^a   Chen, G ^a   Yong, M S ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Curing kinetics; Epoxy molding compounds; Transfer molding

Indexed keywords

CURING KINETICS; EPOXY MOLDING COMPOUNDS; MICROVOID FORMATION; WIRE SWEEP;

ACOUSTIC MICROSCOPES; ACTIVATION ENERGY; CURING; MICROELECTRONICS; REACTION KINETICS; TRANSFER MOLDING;

ELECTRONICS PACKAGING;

EID: 4344635715     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.080     Document Type: Article

References (5)

1. Lupinski J.H. Polymer Materials for Electronics Packaging and Interconnection. 1989;American Chemical Society, Washington DC.
2. Manzione L.T. Plastic Packaging of Microelectronic Devices. 1990;Van Nostrand Reihold, New York.
3. Tummala R.R., Rymaszewi E.J. Microelectronics Packaging Handbook. 1989;Van Nostrand Reihold, New York.
4. Pecht M.G., Agarwal R., McCluskey P., Javadpour S., Mahajan R. Electronic Packaging Materials and Their Properties. 1999;CRC Press, Boca Raton, FL.
5. Pecht M.G., Nguyen L.T., Hakim E.B. Plastic-Encapsulated Microelectronics. 1995;Wiley, New York.