Metal-density driven placement for CMP variation and routability

Proceedings of the International Symposium on Physical Design

Volumn , Issue , 2008, Pages 31-38

  Chen, Tung Chieh ^a   Cho, Minsik ^b   Pan, David Z ^b   Chang, Yao Wen ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b The University of Texas at Austin   (United States)

Author keywords

Manufacturability; Physical design; Placement; VLSI

Indexed keywords

MANUFACTURABILITY; METAL DENSITY; PHYSICAL DESIGN;

MATHEMATICAL MODELS; THICKNESS MEASUREMENT; TOPOGRAPHY; VLSI CIRCUITS;

ROUTING ALGORITHMS;

EID: 43349106266     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1353629.1353638     Document Type: Conference Paper

References (32)