A molecular dynamics study of the deposition and the diffusion behaviors of Al on a Cu surface

Journal of the Korean Physical Society

Volumn 52, Issue 4 PART 1, 2008, Pages 1241-1245

  Kim, S P ^a,b   Lee, K R ^a   Chung, Y C ^b   Kim, Y K ^c   Doi, M ^d   Sahashi, M ^d  

^a Korea Institute of Science and Technology   (South Korea)

^b Hanyang University   (South Korea)

^c Korea University   (South Korea)

^d TOHOKU UNIVERSITY   (Japan)

Author keywords

Cu Al; MD simulation; Surface diffusion; Thin film growth

Indexed keywords

EID: 43149118804     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: 10.3938/jkps.52.1241     Document Type: Article

References (25)