Micro machining process of high temperature pressure sensor gauge chip based on SIMOX SOI wafer

International Journal of Materials and Product Technology

Volumn 31, Issue 2-4, 2008, Pages 375-385

  Wang, Quan ^a   Ding, Jianning ^a   Xue, Wei ^b   Ling, Zhiyong ^a  

^a JIANGSU UNIVERSITY   (China)

^b WENZHOU UNIVERSITY   (China)

Author keywords

High temperature pressure sensor; ICP; LPCVD; SIMOX

Indexed keywords

HIGH TEMPERATURE EFFECTS; INDUCTIVELY COUPLED PLASMA; MICROMACHINING; PHOTOLITHOGRAPHY; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS;

HIGH TEMPERATURE PRESSURE SENSORS; ICP; LPCVD; SIMOX;

PRESSURE SENSORS;

EID: 43149103167     PISSN: 02681900     EISSN: None     Source Type: Journal    
DOI: 10.1504/IJMPT.2008.018034     Document Type: Article

References (20)