60 GHz WPAN standardization within IEEE 802.15.3c

Conference Proceedings of the International Symposium on Signals, Systems and Electronics

Volumn , Issue , 2007, Pages 103-105

  Fisher, Reed ^a  

^a OKI ELECTRIC INDUSTRY CO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INDUSTRIAL ENGINEERING; INTEGRATED CIRCUITS; LABELING; LABELS; PACKET NETWORKS; STANDARDIZATION; STANDARDS;

IEEE 802.15.3; INTERNATIONAL SYMPOSIUM; MILLIMETER WAVE FREQUENCIES; REGULATORY BODIES; SEMICONDUCTOR INTEGRATED CIRCUITS;

FREQUENCY BANDS;

EID: 43049092515     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSSE.2007.4294424     Document Type: Conference Paper

References (7)

1. For 802 activities, see www.ieee802.org.
2. Standard 802.15.3-2003 can be found at: http://standards.ieee.org/ getieee802/
3. B. Gaucher, IBM, IWPC Millimeter wave Sensors Workshop, Reading, UK, Oct. 11-12, 2005. Also 04/665.
4. T-W Huang, "Millimeter wave RFICs using 130 nm CMOS", 2005 IEEE MTT-S, Long Beach, CA. Also 06/475.
5. TG3cwebpage: http://www.ieee802.org/15/pub/TG3c.html. TG3c contributions can be downloaded from this site.
6. Some important SG3c contributions: Call for Applications of mmWave Technology, P802.15-04/240 Project Workplan, 04/241r4. Project Authorization Request. 04/250r5. 5 Criteria. 04/251r3.
7. Some important TG3c Contributions: Selection Criteria, P802.15-05/493r26. Call for Intent, 05/330r2. Usage Models, 06/055r21. System Requirements, 07/583. Channel Models, 07/584 Call for Proposals, 07/586.