Thermal Stability of Electrodeposited Nanocrystalline Ni-and Co-Based Materials

Journal of Iron and Steel Research International

Volumn 14, Issue 5 SUPPL. 1, 2007, Pages 173-178

  KLEMENT, Uta ^a   DA SILVA, Melina ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

3DAP; Co; DSC; EBSD; grain growth; nanocrystalline materials; Ni; TEM; texture; thermal stability

Indexed keywords

EID: 42949162608     PISSN: 1006706X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1006-706X(08)60074-6     Document Type: Article

References (20)

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