Methods of producing plasma enhanced chemical vapor deposition silicon nitride thin films with high compressive and tensile stress

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 26, Issue 3, 2008, Pages 517-521

  Belyansky, M ^a   Chace, M ^a   Gluschenkov, O ^a   Kempisty, J ^a   Klymko, N ^a   Madan, A ^a   Mallikarjunan, A ^a   Molis, S ^a   Ronsheim, P ^a   Wang, Y ^a   Yang, D ^a   Li, Y ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL COMPOSITION; FILM DEPOSITION; MULTILAYER STRUCTURES; X-RAY REFLECTIVITY (XRR);

FOURIER TRANSFORM INFRARED SPECTROSCOPY; HYDROGEN BONDS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; TEMPERATURE MEASUREMENT; TENSILE STRESS; THIN FILMS;

SILICON NITRIDE;

EID: 42949111167     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2906259     Document Type: Article

References (17)