Seasoning of plasma etching reactors: Ion energy distributions to walls and real-time and run-to-run control strategies

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 26, Issue 3, 2008, Pages 498-512

  Agarwal, Ankur ^a,c   Kushner, Mark J ^b  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b Iowa State University of Science and Technology   (United States)

^c APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ION ENERGY DISTRIBUTIONS; PLASMA GENERATED SPECIES; SPUTTERED PRODUCTS;

ACTIVATION ENERGY; CHEMICAL REACTORS; FREE RADICALS; REAL TIME CONTROL; WAFER BONDING;

PLASMA ETCHING;

EID: 42949103124     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2909966     Document Type: Article

References (43)