Modeling and characterization of viscoelasticity of PI/SiO2 nanocomposite films under constant and fatigue loading

Materials Science and Engineering: A

Volumn 486, Issue 1-2, 2008, Pages 517-527

  Wang, Z D ^a   Zhao, X X ^a  

^a BEIJING JIAOTONG UNIVERSITY   (China)

Author keywords

Creep; Model; PI SiO2; Viscoelasticity

Indexed keywords

COMPUTER SIMULATION; CREEP RESISTANCE; DEFORMATION; FATIGUE OF MATERIALS; HARDENING; NANOCOMPOSITES; TENSILE STRESS; THIN FILMS; VISCOELASTICITY;

BURGER MODEL; CYCLIC HARDENING; FATIGUE LOADING; FINDLEY POWER LAW; VISCOELASTIC MODEL;

CERAMIC MATRIX COMPOSITES;

CERAMIC MATRIX COMPOSITES; COMPUTER SIMULATION; CREEP RESISTANCE; DEFORMATION; FATIGUE OF MATERIALS; HARDENING; NANOCOMPOSITES; TENSILE STRESS; THIN FILMS; VISCOELASTICITY;

EID: 42949094218     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.09.041     Document Type: Article

References (31)