Selection panel for reliable soldering systems

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 2, Issue , 2006, Pages 1249-1251

  Nieland, Sabine ^a   Bähr, Mario ^a  

^a CiS Institut for Microsensors Erfurt   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLICS; METALLIZING; PARAMETER ESTIMATION; SOLDERED JOINTS;

LEAD-FEE SOLDERS; PHASE FORMATION;

SOLDERING;

EID: 42549170031     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280170     Document Type: Conference Paper

References (2)

1. 1.http://doc.tms.org/ezMerchant/prodtms.nsf/ProductLoo kupItemID/JOM-0306-61/$FILE/JOM-0306-61F.pdf?OpenElement
2. S. Nieland, PhD theses (http://edocs.tu-berlin.de/diss/2002/ nieland_sabine.pdf)