Development of Quality Control (QC) tools for solder pastes used for flip chip assembly based on oscillatory tests

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 347-353

  Durairaj, R ^a   Seman, A ^a   Ekere, N N ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; FLIP CHIP DEVICES; QUALITY CONTROL; RHEOLOGY; STRUCTURAL ANALYSIS;

OSCILLATORY TESTS; PASTE MATERIALS; SOLDER PASTES;

ADHESIVE PASTES;

EID: 42549164587     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280024     Document Type: Conference Paper

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