Properties and reliability test of anisotropic conductive film in chip on glass package

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 51-55

  Chen, Kai Chi ^a   Li, Hsun Tien ^a   Hsu, Chia Wen ^a   Yang, Ching Ping ^b  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON DEVICE TESTING; ELECTRONICS PACKAGING; GLASS BONDING; OPTICAL ANISOTROPY; TEMPERATURE MEASUREMENT;

ANISOTROPIC CONDUCTIVE FILMS (ACF); GLASS PACKAGES; RELIABILITY TESTING; TOUGHNERS;

CONDUCTIVE FILMS;

EID: 42549161007     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.279977     Document Type: Conference Paper

References (9)

1. Dudek, R., et al., 'Flow characterization and thermomechanical response of anisotropic conductive films", IEEE Trans-CPMT-A. Vol.22, No2 (1999). p177-185.
2. Chiang, K.N.,Chang, C.W.. Lin. C.T., 'Process Modeling and Thermallmechanical behavior of ACNACF type flip-chip packages 'I, J. of Electronic Packaging, 123 (200 1), p.331-337
3. S. Asai et al., "Development of an Anisotropic Conductive Adhesive Film(ACAF) from Epoxy Resins," J. of Appl. Polym. Sci. 56, 769-777(1995)
4. H. Date et al., "Anisotropic Conductive Adhesive for Fine Pitch Interconnections," Proc., International Symposiums on Microelectronics '94, 570-575(1994)
5. A. Torri, M. Takizawa, and K. Sasahara, "Development of Flip Chip Bonding Technology using Anisotropic Conductive Film," Proc., 9th International Microelectronics Conference, 324-327(1996)
6. Shikoku Chemicals Corporation, "Imidazole derivatives for Epoxy Resin." 1998
7. JEITA-Japan Electronics and Information Technology Industries Association, Test Method C-121- Shear Strength Test
8. JEDEC STANDARD - Temperature Humidity Bias Lifetest - JESD22-A101-B.
9. JEDEC STANDARD-Temperature Cycling-JESD22-A104-B.