Deformation property measurement for single anisotropic conductive adhesive particles

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 2, Issue , 2006, Pages 840-847

  Dou, Guangbin ^a   Whalley, David ^a   Liu, Changqing ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CONDUCTIVE MATERIALS; DEFORMATION; NANOINDENTATION; POLYMER MATRIX;

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); POLYMER ADHESIVE MATRIX;

ADHESIVES;

EID: 42549133489     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280109     Document Type: Conference Paper

References (9)

1. Liu, J., Conductive Adhesive for Electronics Packaging. 1999, Electrochemical Publications Ltd, Port Erin, Isle of Man, British Isles:.
2. Liu, J., ACA bonding technology for low cost electronics packaging applications - Current status and remaining challenges. Soldering & Surface Mount Technology, 2001. 13(3): p. 39-57.
3. Dou, G. B., Electrical Conductive Characteristics of ACA Bonding: A Review of the Literature, Current Challenges and Future Prospects. in Proceeding of the 6th IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04). 2004. Shanghai, China.
4. Holloway, M. Novel Anisotropically Conductive Film for Area Array Packaging, in Advances in Electronic Packaging. 1999: ASME.
5. Fu, Y., Wang, Y. L., Wang, X. T., Liu, J. H., Lai, Z. H., Chen, G. L., Willander, M., Experimental and theoretical characterization of electrical contact in anisotropically conductive adhesive. IEEE Transactions on Advanced Packaging, 2000. 23(1): p. 15-21.
6. Chiang, K.N., C.W., Chang, and J.D. Lin. Analysis of ACA/ACF package using equivalent spring method, in Proceedings of 3rd Electronics Packaging Technology Conference. 2000. Singapore.
7. Kristiansen H., Bradberg U., and Gulliksen M., Electrical and Mechanical Properties of Metal-coated Polymer Spheres for Anisotropic Conductive Adhesive. The Second IEEE International Symposium on Polymer Electronics Packaging. 1999. Gothenburg, Sweden.
8. Shen Y., Mechanical Properties of Conductive Particles for Anisotropic Conductive Adhesive (ACA). A Master Thesis of Material Science and Engineering, Chalmers University of Technology 9 http://www.micromaterials.co.uk
9. http://www.conpart.no