Dynamic mechanical thermal analysis, forming and mold fabrication studies for hot-embossing of a polyimide microfluidic platform

Journal of Micromechanics and Microengineering

Volumn 18, Issue 4, 2008, Pages

  Youn, Sung Won ^a   Noguchi, Toshihiko ^a   Takahashi, Masaharu ^a   Maeda, Ryutaro ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

MICROSTRUCTURE; PLASMA ETCHING; POLYIMIDES; THERMOANALYSIS;

DYNAMIC MECHANICAL THERMAL ANALYSIS (DMTA);

MICROFLUIDICS;

EID: 42549117131     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/4/045025     Document Type: Article

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