Metallic porous parts for electronics devices cooling

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 343-346

  Lucaci, Mariana ^a   Orban, Radu L ^b   Soare, Gheorghe ^c   Lungu, Magdalena Valentina ^a   Kappel, Wilhelm ^a  

^a Wallachian University of Targoviste   (Romania)

^b TECHNICAL UNIVERSITY OF CLUJ NAPOCA   (Romania)

^c UNIVERSITY POLITEHNICA OF BUCHAREST   (Romania)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; COPPER PIPE; ELECTRONIC EQUIPMENT; EVAPORATORS; HEAT PIPES; TEMPERATURE MEASUREMENT;

COPPER HEAT PIPES; ELECTRONIC COMPONENTS COOLING; THERMAL FLOW;

POROUS MATERIALS;

EID: 42549104111     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280023     Document Type: Conference Paper

References (5)

1. P.M.Dunn, D.A. Reay - Heat Pipes, Fourth Edition, Pergamon Press, Elsevier Science Ltd, Copyright 1994
2. nd International Energy Conversion Engineering Conference (IECEC)2004
3. Devarakonda A, Daxi Xiong, Duane E. Beach, Intermediate Temperature Water Heat Pipe Tests, National research Council-NASA Research Associate at Glenn Research Center, NASA/TM-2005-21358.
4. Lucaci, M.Lungu, St. Gavriliu, E. Enescu- Thermally conducting porous materials for cooling of electronic components, Euro PM2005 Congress& Exhibition Proceedings, vol. 1, 2005, p- 457-462,
5. O. Floarea, et al, Operations and Equipment in Chemical Industry, Problems, Ed. Didactica and Pedagogica, Bucharest, 1980, p. 500-518