CO2-assisted embossing for the fabrication of PMMA components under low temperature and with low pressure

Journal of Micromechanics and Microengineering

Volumn 18, Issue 2, 2008, Pages

  Yang, Sen Yeu ^a   Huang, Tzu Chien ^a   Ciou, Jyun Kai ^a   Chan, Bin Da ^a   Loeser, John G ^b  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b OREGON STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PLASTICIZERS; POLYMETHYL METHACRYLATES; PRESSURE DISTRIBUTION; PRESSURIZATION; RESIDUAL STRESSES;

PROCESS PARAMETERS; REPLICATION QUALITY;

CARBON DIOXIDE;

EID: 42549098241     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/2/025024     Document Type: Article

References (7)

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2. Chang J H, Cheng F S, Chao C C, Weng Y C, Yang S Y and Wang L A 2005 Direct imprinting using soft mold and gas pressure for large area and curved surfaces J. Vac. Sci. Technol. A 1687 23
3. Khang D Y and Lee H H 2000 Room-temperature imprint lithography by solvent vapor treatment Appl. Phys. Lett. 870 76
4. 2-assisted patterning of polymers J. Phys. Chem. B 12376 109
5. 2 assisted nanoimprinting and cold embossing ANTEC pp 2551-5
6. 2) assisted nanoimprint lithography using polymeric mold Microelectron. Eng. 1957 83
7. 2 application in the processing of polymers Ind. Eng. Chem. Res. 6431 42