Low tolerance epoxy/BaTiO3 composite embedded capacitor films (ECFs)

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 341-347

  Paik, Kyung Wook ^a   Cho, Sung Dong ^a   Lee, Joo Yeon ^a   Hyun, Jin Gul ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BARIUM COMPOUNDS; CAPACITORS; CHIP SCALE PACKAGES; COMPOSITE FILMS; CURING; DIELECTRIC MATERIALS; DISPERSIONS; EMBEDDED SYSTEMS; FITS AND TOLERANCES; LEAKAGE CURRENTS; MECHANICAL STABILITY; MODIFIED ATMOSPHERE PACKAGING; PERMITTIVITY; PRINTED CIRCUIT BOARDS; PRINTED CIRCUITS; SILICON; SILICON WAFERS; SUBSTRATES; TEMPERATURE;

DECOUPLING CAPACITOR; EMBEDDED CAPACITOR FILMS; HIGH DIELECTRIC CONSTANTS; LATENT CURING AGENTS; PACKAGING TECHNOLOGIES; PRINTED CIRCUIT BOARD (PCBS); PROCESS COMPATIBILITY; THERMOMECHANICAL STABILITY;

EPOXY RESINS;

EID: 42449127364     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188862     Document Type: Conference Paper

References (11)

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