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Volumn 985, Issue , 2008, Pages 788-795

Thermal conductivity of powder insulations below 180 k

Author keywords

Heat transfer; Powder insulation; Thermal conductivity

Indexed keywords


EID: 42449099292     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.2908672     Document Type: Conference Paper
Times cited : (5)

References (14)
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    • Thermal Performance Testing of Glass Microspheres Under Cryogenic Vacuum Conditions
    • June
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    • (2004) Advances in Cryogenic Engineering , vol.710 , Issue.1
    • Fesmire, J.E.1    Augustynowicz, S.D.2
  • 4
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    • Evacuated powder insulation for low temperatures
    • M. M. Fulk, "Evacuated powder insulation for low temperatures," Progress in Cryogenics 1, 1959, pp. 65-84.
    • (1959) Progress in Cryogenics , vol.1 , pp. 65-84
    • Fulk, M.M.1
  • 5
    • 0017426749 scopus 로고
    • Thermal Conductivity of Microsphere Cryogenic Insulation
    • A.L. Nayak, C.L. Tien, "Thermal Conductivity of Microsphere Cryogenic Insulation," in Advances in Cryogenic Engineering 22, 1977, pp. 251-262.
    • (1977) Advances in Cryogenic Engineering , vol.22 , pp. 251-262
    • Nayak, A.L.1    Tien, C.L.2
  • 9
    • 42449112715 scopus 로고    scopus 로고
    • Measuring Thermal Conductivity of Powder Insulations at Cryogenic Temperatures,
    • M.S. Thesis, Mechanical Engineering Department, Florida State University
    • M.N. Barrios, "Measuring Thermal Conductivity of Powder Insulations at Cryogenic Temperatures," M.S. Thesis, Mechanical Engineering Department, Florida State University, 2006. http://etd.lib.fsu.edu/theses/available/etd- 10312006-170416/
    • (2006)
    • Barrios, M.N.1
  • 10
    • 42449126873 scopus 로고    scopus 로고
    • http://www.cabot-corp.com/cws/product.nsf/PDSKEY/~AEB/$file/ NG_Aerogel_Beads.pdf?OpenElement
  • 11
    • 42449140871 scopus 로고    scopus 로고
    • http://multimedia.mmm.com/mws/mediawebserver.dyn? UUUUUUC04ehUnx7UGx7UUUC&KEOttttS-
  • 12
    • 0025433574 scopus 로고
    • Conduction shape factor for a region of uniform thickness surrounding a three-dimensional body of arbitrary shape
    • A.V. Hassani, K.G.T. Hollands, "Conduction shape factor for a region of uniform thickness surrounding a three-dimensional body of arbitrary shape," in Journal of Heat Transfer, Vol. 112, 1990, pp. 492-495.
    • (1990) Journal of Heat Transfer , vol.112 , pp. 492-495
    • Hassani, A.V.1    Hollands, K.G.T.2
  • 13
    • 0024037686 scopus 로고
    • The Influence of Residual Gas Pressure on the Thermal Conductivity of Microsphere Insulations
    • R. Wawryk, J. Rafalowicz, "The Influence of Residual Gas Pressure on the Thermal Conductivity of Microsphere Insulations," in International Journal of Thermophysics, Vol. 9, No. 4, pp. 611-625, 1988.
    • (1988) International Journal of Thermophysics , vol.9 , Issue.4 , pp. 611-625
    • Wawryk, R.1    Rafalowicz, J.2
  • 14
    • 0041599929 scopus 로고
    • Heat Transfer in Microsphere Insulation in the Presence of a Gas
    • Vladimir V. Mirkovich, ed
    • G.R. Cunnington, and CL. Tien, "Heat Transfer in Microsphere Insulation in the Presence of a Gas," in Thermal Conductivity 15, Vladimir V. Mirkovich, ed., 1978, pp. 325-333.
    • (1978) Thermal Conductivity 15 , pp. 325-333
    • Cunnington, G.R.1    Tien, C.L.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.