Hole filling of a 3D model by flipping signs of a signed distance field in adaptive resolution

IEEE Transactions on Pattern Analysis and Machine Intelligence

Volumn 30, Issue 4, 2008, Pages 686-699

  Sagawa, Ryusuke ^a   Ikeuchi, Katsushi ^b  

^a OSAKA UNIVERSITY   (Japan)

^b INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

Author keywords

Adaptive signed distance field; Interpolation of a mesh model; Three dimensional modeling

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; CONVERGENCE OF NUMERICAL METHODS; DISTANCE MEASUREMENT; INTERPOLATION; ITERATIVE METHODS; PARTIAL DIFFERENTIAL EQUATIONS;

MESH MODEL; SIGNED DISTANCE FIELD; VOXEL;

OBJECT RECOGNITION;

ALGORITHM; ARTICLE; ARTIFICIAL INTELLIGENCE; AUTOMATED PATTERN RECOGNITION; COMPUTER ASSISTED DIAGNOSIS; COMPUTER GRAPHICS; COMPUTER SIMULATION; IMAGE ENHANCEMENT; METHODOLOGY; REPRODUCIBILITY; SENSITIVITY AND SPECIFICITY; THEORETICAL MODEL; THREE DIMENSIONAL IMAGING;

ALGORITHMS; ARTIFICIAL INTELLIGENCE; COMPUTER GRAPHICS; COMPUTER SIMULATION; IMAGE ENHANCEMENT; IMAGE INTERPRETATION, COMPUTER-ASSISTED; IMAGING, THREE-DIMENSIONAL; MODELS, THEORETICAL; PATTERN RECOGNITION, AUTOMATED; REPRODUCIBILITY OF RESULTS; SENSITIVITY AND SPECIFICITY;

EID: 42449090329     PISSN: 01628828     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPAMI.2007.70726     Document Type: Article

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